ATLANTA – ECIA’s Industry Pulse market sentiment index reached 154 in June, its highest level in five years and just below the all-time high of 157 recorded in March 2021. The June reading increased 7 ...
HUIZHOU, CHINA – Victory Giant Technology plans to invest at least 3 billion yuan ($444 million) in a new PCB manufacturing facility in Huizhou as the Chinese board maker expands capacity to meet ...
PEACHTREE CITY, GA – The discounted price for the PCB West 2026 technical conference ends August 21, conference organizers said today. From August 22 through September 29, registrants will pay the ...
BROOKLYN, NY – South Korean automotive interior materials manufacturer Unichem has signed a term sheet to acquire flexible electronics company Loomia Technologies for up to $6 million, with plans to ...
Atlanta – Following the five-year high registered by the June Industry Pulse survey, the July index fell by 12.5 points to 141.6.
The Printed Circuit Engineering Association (PCEA) today announced publication of the sixth edition of PCB Basics: An Introduction to the PCB Industry. The book is available for free download to all ...
In a newly established Plus One factory, a scrapped batch is a full-blown crisis. If buffer stock of a specific material isn't available—which is rarely the case for low-volume mix—the factory has to ...
AI-driven demand is reshaping semiconductor supply chains, prompting manufacturers to prioritize capacity, adjust pricing and tighten availability for mature-node devices. The second quarter of 2026 ...
TAIPEI – Tight DRAM supply expected to persist through 2027 is prompting Nvidia to evaluate lower HBM configurations for its next-generation Rubin Ultra AI platform, according to TrendForce. Nvidia ...
The AI server boom is creating significant opportunities for the PCB industry, provided manufacturing capacity can scale to meet growing demand.
RICHMOND, VA – Reliability remains the dominant consideration for engineers selecting components for PCB designs, while artificial intelligence has become a common part of the design workflow, ...
Understanding the difference between process capability and design intent enables engineers to maximize UHDI performance while improving manufacturability and yield. Ultra high-density interconnect ...
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