Carbon ID hydrogen fuel cell bipolar plates for aerospace combine contradictory properties for a corrosion-free alternative ...
Since his postdoctoral days at MIT, Hang Yu, associate professor of materials science and engineering, has been wrestling ...
Hungry individuals don't put much thought into the packaging of their food. When people grab a snack, they generally rip into ...
Objective: To evaluate the clinical longevity of Class I and II composite resin restorations with and without using sonic energy through a systematic literature review and meta-analysis. Material and ...
No matter how many times I’ve packed my suitcases to go home (and as a bicoastal student, that’s a lot), I always dread it. Sometimes I make a list and still forget something important, and other ...
Huawei Technologies’ three-year-old patent for advanced patterning comparable with 2-nanometre grade technology without extreme ultraviolet (EUV) lithography tools has intensified speculation about a ...
A new technical paper titled “Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity” was published by researchers at Arizona State University and University ...
At the Malikah Safety Center in Astoria, Queens, Muslim women are learning more than just self-defense. "After 9/11, I experienced a hate-based attack and started to think about my skills as a martial ...
James is a published author with multiple pop-history and science books to his name. He specializes in history, space, strange science, and anything out of the ordinary.View full profile James is a ...
Abstract: This article considers the adaptive stability control of a class of $2\times 2$ linear hyperbolic PDE systems. The PDE model is subject to constant but in-domain and boundary unknown ...
Transferable Hybrid Bonding Technique That Allows For High Integration Density In Advanced Packaging
A technical paper titled “Hierarchical Multi-Layer and Stacking Vias with Novel Structure by Transferrable Cu/Polymer Hybrid Bonding for High Speed Digital Applications” was published by researchers ...
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