AI-driven demand for advanced chip packaging has outstripped supply, with TSMC’s CoWoS capacity largely booked by major players like Nvidia and AMD. Intel is promoting its EMIB-T technology as a lower ...

On the front-end, 3nm advanced process capacity—currently dominated by TSMC—has become even more constrained, turning into a ...

Penang is elevating itself for phase "2.0" of its semiconductor evolution, said its Port Commission chairman Datuk Yeoh Soon ...

Intel is relocating a data center chip production line from Costa Rica to its Vietnam facility. The move, flagged in a Saigon ...

Onto Innovation recently reported first‑quarter 2026 results with revenue rising to US$291.95 million but net income falling to US$33.75 million, while earnings per share declined versus a year ...

Elon Musk is considering a Grimes County site near College Station for a massive semiconductor manufacturing complex called ...

Advanced Packaging Has Become the Bottleneck Intel (INTC) is attempting to reposition itself in the semiconductor value chain ...

Intel has transferred over 30 chip assembly and testing devices to Saigon High-Tech Park and Vietnam National University Hanoi.

Samsung crosses the $1 trillion valuation mark as booming AI memory demand drives profits, chip sales and investor confidence ...

As package sizes grow, warpage can become a real headache. A ceramic approach can offer rigidity where traditional materials ...

It is currently quite difficult to underpin a consistent set of assumptions. Forecast scenarios are in lieu of traditional ...

Foundry service provider Vanguard International Semiconductor Corp (世界先進) yesterday said it is adjusting its product ...