Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million it was granted from the US CHIPS Act. Now, Fab 9 and its neighbor, Fab 11X ...

What's driving semiconductor stocks higher in the near term and long term?

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

Advanced Packaging Has Become the Bottleneck Intel (INTC) is attempting to reposition itself in the semiconductor value chain ...

Taiwan Semiconductor Manufacturing (TSMC) said it plans to open an advanced chip packaging facility in Arizona by 2029, ...

Can KLA's AI-driven packaging boom and rising chip complexity power advanced packaging revenues to $1B by 2026?

South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging ...

ASML (ASML) shipped its first advanced packaging lithography system in late 2025 to expand beyond EUV. Taiwan Semiconductor holds over 50% of the high-end CoWoS advanced packaging market for AI chips.

Some Galaxy S27 models are expected to be powered by the Exynos 2700 processor, but a new report suggests a concerning silicon change.

Taiwan Semiconductor Manufacturing (TSM) expects the global semiconductor market to exceed $1.5T by 2030, boosting its prior ...

Taiwan Semiconductor Manufacturing Co (ADR) (NYSE:TSM), the world's largest contract chipmaker, now expects the global ...

The semiconductor equipment industry is entering 2026 with a stronger demand backdrop than the broader cyclical slump of 2022 ...