Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging ...

Can KLA's AI-driven packaging boom and rising chip complexity power advanced packaging revenues to $1B by 2026?

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

AI thrives on data but feeding it the right data is harder than it seems. As enterprises scale their AI initiatives, they face the challenge of managing diverse data pipelines, ensuring proximity to ...

Leading contract chip manufacturer Taiwan Semiconductor Manufacturing(NYSE: TSM) estimates the semiconductor market will ...

Shares of Intel (INTC) rose on Monday amid growing optimism that the chipmaker could secure a significant new customer for ...

By Wen-Yee Lee TAIPEI, April 29 (Reuters) - Taiwan’s ASE Technology Holding, the world’s largest chip packaging and testing provider, said on Wednesday it expected revenue from its leading‑edge ...

India’s chip ambitions are moving beyond fabs toward advanced packaging, glass substrates, and chiplets technologies that ...

ASML (ASML) shipped its first advanced packaging lithography system in late 2025 to expand beyond EUV. Taiwan Semiconductor holds over 50% of the high-end CoWoS advanced packaging market for AI chips.

SEOUL, Jan 13 (Reuters) - South ‌Korea's SK Hynix said ‌on Tuesday it has decided to invest 19 trillion won ($12.90 billion) to build an ‍advanced chip packaging plant in South Korea to meet rising ...

This AI infrastructure leader could prove to be an exceptional pick in the long run.