The new module is based on Micron’s advanced 1-gamma DRAM process technology and supports speeds of up to 9,200 megatransfers per second (MT/s), exceeding the performance of current production DDR5 ...
The MIPI Alliance has announced the formation of a Physical AI Birds of a Feather (BoF) group focused on emerging technologies in the physical AI market, with an initial emphasis on humanoid robotics.
TDK Corporation has introduced SensorStage, a comprehensive evaluation platform developed to simplify and accelerate the design and analysis of its SmartMotion inertial measurement units (IMUs). The ...
The transition from subscriber identity module (SIM) cards to integrated SIMs (iSIMs) is transforming the design, manufacturing, and provisioning of embedded devices. Devices from mobile phones and ...
Bosch Sensortec unveils its BMI5 platform motion sensor platform at CES 2026. This new generation of inertial sensors delivers high-precision performance for a range of applications, including ...
AMD has announced the acquisition of Enosemi, a strategic move aimed at accelerating innovation in co-packaged optics for next-generation AI systems. This acquisition represents a pivotal advancement ...
The Qualcomm Dragonwing IQ10 is the premium-tier robotics chip for advanced autonomous machines. The chipset features an 18-core Oryon CPU paired with an AI engine to deliver up to 700 TOPS ...
NXP Semiconductors has announced the launch of its S32K5 family of automotive microcontrollers (MCUs), marking a significant milestone as the industry’s first 16nm FinFET-based MCU with embedded ...
Although any C programmer could easily learn another programming language and quickly become proficient in it, C continues to be the dominant language for embedded software programming. One reason for ...
While demand for proximity detection continues to grow across IoT, automotive, and logistics applications, current solutions remain hindered by insecurity and imprecision. Bluetooth Channel Sounding ...
In today’s rapidly evolving tech landscape, companies are pushing the boundaries of innovation to meet the growing demand for smaller, more powerful embedded solutions. From ultra-compact ...
The transition from “lead frame” designs to ICs mounted on multilayer circuit substrates with complex wiring patterns resulted in the need for advanced IC substrates, creating an urgent demand for new ...
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