The packaging industry is shifting from sustainability claims to measurable performance, driven by stricter regulations like ...

American Packaging Corporation (APC) continues to expand its sustainable packaging offerings with Design for Recycle (or ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

OrbitIO interconnect designer capabilities deliver hierarchical multi-substrate-optimized design for SoCs and ASICs across IC package/SiP and systems SAN JOSE, Calif., May. 04, 2016 – Cadence Design ...

Packaging often stands as the first physical point of contact between a brand and its audience. While often overlooked or treated as an afterthought, package design reflects a brand’s attention to ...

Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...

Dezeen Competitions: The Salmon Packaging Design Competition tasks designers with creating innovative packaging using corrugated cardboard sourced from sustainable and renewable materials. The ...