Digi Times

GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric and Advanced Process Technologies

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...

GUC showcase VSORA’s Jotunn8 AI inference processor at the TSMC Europe Technology Symposium

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced Jotunn8, a next-generation data center AI inference processor developed by VSORA, at the TSMC Europe Technology Symposium. This ...
Digi Times

GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers

Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic partnership to integrate CPO into GUC ...
WNCT

GUC to start their, ‘Operation Spring Clean’ program Sunday

GREENVILLE, N.C. (WNCT) — The Greenville Utilities Commission (GUC) will begin their annual, ‘Operation Spring Clean’ program soon. Starting April 13, GUC will work on cleaning about half of the 722 ...
Semiconductor Engineering

GUC GLink Test Chip Uses In-Chip Monitoring And Deep Data Analytics For High Bandwidth Die-To-Die Characterization

Advanced ASIC leader Global Unichip Corp (GUC) has developed GLink, a high-bandwidth, low-latency, and power-efficient die-to-die (D2D) interface. GLink offers the industry’s highest optimized ...
EDN

GUC Announces New Domain Name

The new domain name is the most recent development in GUC's on-going initiative to substantiate its evolving reputation as a leader in the semiconductor industry's ASIC segment. The company has also ...