Centre is targeting to make high-tech small chips of 2-3 nanometer (nm) node that are used in products like modern ...

India Semiconductor Mission 2.0 will prioritise indigenous chip design, their productisation, attracting ecosystem partners and development of talents, Union Minister Ashwini Vaishnaw said on Saturday ...

The Indian government, led by Union Minister Ashwini Vaishnaw, plans to produce 3-nanometer chips by 2032 to enhance domestic tech capabilities. The second phase of the Design-Linked Incentive Scheme ...

Union Minister Ashwini Vaishnaw outlines India Semiconductor Mission 2.0s focus on chip design, ecosystem partners, and ...

Qualcomm (NasdaqGS:QCOM) is working with Samsung on potential two nanometer chip manufacturing to support its next wave of AI ...

Ashwini Vaishnaw Releases 2-Nm Qualcomm Chip, Calls It Major Development For Country. Bengaluru, Feb 7 (IANS) Union Minister for Railways, Electronics and Information Technology Ashwini Vaishnaw, on ...

The Indian government aims to produce high-tech 3-nanometer chips by 2032, as part of its Design-Linked Incentive Scheme. The initiative focuses on advancing the domestic chip ecosystem, covering six ...

Minister of Electronics and Information Technology Ashwini Vaishnaw on Tuesday expressed confidence that as the country moves towards 2029, and the second phase of country''s semiconductor mission ...

Startup Substrate is building next-generation semiconductor fabs using advanced X-ray lithography. This goes beyond extreme ultraviolet 13.5 nanometer wavelengths down to 0.01 nanometers. At the core ...

Union minister Ashwini Vaishnaw announced Tata's Dholera fab will assist Indian chip startups with design tape-outs, aiming ...

TOKYO/TAIPEI, Feb 5 (Reuters) - TSMC plans to mass produce advanced 3-nanometre chips in Kumamoto in southern Japan, TSMC CEO C.C. Wei said on Thursday, an investment local media reported was worth ...