Researchers at the University of Texas at Austin are researching coolants for the immersion cooling method, seen as the ...

Electronic devices generate heat, and that heat must be dissipated. If it isn’t, the high temperatures can compromise device function, or even damage the devices and their surroundings. Now, a team ...

13.6. Trend of Die Sizes - Si IGBT and SiC MOSFET 13.7. SiC MOSFET and Si IGBT: Die Area for Inverters - mm2/kW 13.8. Table Summarizing the Si IGBT and Si MOSFET Die Area for Inverters 13.9. SiC ...

Quantum computers could rapidly solve complex problems that would take the most powerful classical supercomputers decades to unravel. But they'll need to be large and stable enough to efficiently ...

Compact electronics present a unique challenge when it comes to cooling. While thermal management is becoming a growing concern amid increased chip functionality, smaller devices mean there’s less ...

Heat is the inevitable byproduct of electronic devices. It is also the most common cause of electronics failure. As such, electronics need to be cooled and fans are the most popular way to cool them.

A layer of graphene can reduce the working temperature in hotspots inside a processor by up to 25 percent – which can significantly extend the working life of computers and other electronics. An ...

A new technical paper titled “Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling” was published by researchers at University of Illinois, Urbana, University ...

Thermal management is crucial for performance, reliability, and safety of batteries. There are different methods available to maintain the ideal temperature in a battery pack for an electric vehicle ...

Electronic devices generate heat, and that heat must be dissipated. The high temperatures can compromise device function or even damage the devices and surroundings if it isn't. Now, a team has ...