A recent review focuses on the development and optimization of thermal management technologies (TMTs) for spacecraft electronics. These technologies address the challenges of heat acquisition, ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...

Thermal management deals with problems arising from heat dissipation, thermal stresses and warping. It is critical in the packaging of power semiconductors and other microelectronic and optoelectronic ...

The year 2025 is poised to be a landmark year for liquid cooling technology in electronics, with rapid growth expected through 2026 and 2027, according to Ching-Hang Shen, President of Asia Vital ...

AI growth is driving a hidden cooling crisis. Why PCHE heat exchangers are vital to future chip infrastructure.

The electronics engineering landscape has experienced significant changes in the past half-decade, driven by technological advancements and global trends and disruptions. Significant limitations faced ...