MicroProbe announced today that more than 1,000 Vx and Mx vertical MEMS probe cards now are deployed worldwide in copper pillar applications. Once restricted to use in high-end logic devices, the ...
The thermal copper pillar bump, or thermal bump, is a thermoelectric device made from thin-film thermoelectric material embedded in flip-chip interconnects (in particular, copper pillar bumps) for use ...
A potential breakthrough technology from Nextreme (Research Triangle Park, NC)—a microscale thermal and power-management device manufacturer—integrates cooling and power-generation capabilities into ...
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